two-component silicon liquid thermal conductive gap filler with a thermal conductivity of 2.0W/m-K. The product has low viscosity and good thixotropy when mixed in a 1:1 ratio, is easy to dispense and operate, has excellent slump resistance and high shear thinning characteristics, and the mixing system can cure quickly at room temperature or in a heated state.Thermal adhesive products can produce compression set of more than 70% when the external pressure is small, so it can be easily filled into the surface of the heating device and the surrounding gaps to form a thermal film bridge with the heat sink. After curing, the product forms a 3D elastomer structure with extremely low compressive and residual stresses to protect sensitive components from damage.